Specifications
About 241 wordsLess than 1 minute
2026-09-02
This page is a summary. The full parameter table — with a stage-by-stage description of the protection chain and the component choices — is on the product page.
Basic Parameters
| Parameter | Specification |
|---|---|
| Model | XT-C-485-HIA-V3/5 |
| Isolated transceiver | TDA51S485HC (isolated supply + isolated signal, SOIC-16W) |
| Supply voltage | 3.0 – 5.5 V (3.3 V / 5 V typical) |
| Supply current | 27.9 mA @ 3.31 V; 22.7 mA @ 5.01 V |
| Communication mode | RS-485 half-duplex, automatic direction control (no DE/RE signal needed) |
| Max data rate | 500 kbps |
| Bus load | 256 nodes (1/8 unit load) |
| Operating temperature | −40 ~ +125 °C |
| Dimensions | 90 × 20 mm |
| Board thickness | 1.6 mm |
Mounting: SMD or Through-Hole
Every pad carries both features, so one board supports both mounting styles:
| Feature | Position | Purpose |
|---|---|---|
| Castellated half-hole (stamp hole) | Cut at the board edge | For SMD reflow: the module sits flat on your main board like an ordinary SMD part |
| Full plated through-hole | Hole centre inside the board | For through-hole: insert a 2.54 mm pin header or a 5.08 mm terminal when you prefer not to reflow |
The two mounting styles are electrically equivalent — pick whichever suits your production line.
Interfaces
| Side | Pins | Pitch |
|---|---|---|
| Logic side | VIN / RX / TX / GND | 2.54 mm |
| Bus side | B / PE / A | 5.08 mm |